NXP恩智浦半導(dǎo)體應(yīng)用手冊
AN10439 晶圓級芯片封裝
keywords 關(guān)鍵字
wafer,level,chip-scale,chip-size,package,WLCSP
摘要
This application note provides guidelines for the use of Wafer Level Chip Size Packages (WLCSP). For information on printed circuit board (PCB),footprint design and reflow soldering see application note AN10365 (Surface mount reflow soldering description).
該應(yīng)用手冊可作為晶圓級芯片大小封裝（Wafer Level Chip Size Packages (WLCSP)）的使用指導(dǎo)。關(guān)于PCB印刷電路板引腳以及焊接的相關(guān)內(nèi)容，請參考應(yīng)用手冊AN10365。
AN10897 ESD和EMC設(shè)計指導(dǎo)
keywords 關(guān)鍵字
ESD,EMC,PCB design
摘要
An introductory approach to designing for ESD. Understanding the ESD pulse, how passive components react over frequency, and PCB layout techniques are exposed.
本文檔介紹了ESD的設(shè)計。詳細(xì)介紹了ESD脈沖、被動器件對頻率的反應(yīng)、PCB布局等。
AN10897 ESD和EMC設(shè)計指導(dǎo).PDF
AN10436 TDA8932B/33(B) Class-D 音頻放大器
keywords 關(guān)鍵字
Class-D amplifier,High efficiency,Switch mode amplifier,Flat TV,平板電視
摘要
This application note describes a stereo Switched Mode Amplifier (SMA) for audio, based on either the TDA8932B or TDA8933(B) Class-D audio amplifier device of NXP Semiconductors, which has been designed for Flat TV applications.
該應(yīng)用手冊詳細(xì)描述了基于NXP TDA8932B 或者 TDA8933(B) Class-D 器件的立體聲音頻放大器。NXP恩智浦半導(dǎo)體該產(chǎn)品已經(jīng)設(shè)計應(yīng)用于平板電視。
